Method for forming bumps in substrates with through vias

ABSTRACT

A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the priority benefit of Italian patentapplication number M12008A1505, filed on Aug. 8, 2008, entitled “METHODFOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS,” which is herebyincorporated by reference to the maximum extent allowable by law.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The solution according to an embodiment of the present invention regardsthe electronic field in general, and in particular it regards bumps forthrough vias.

2. Discussion of the Related Art

As it is known to those skilled in the electronic field, a through viais a substantially vertical electrical connection that completelycrosses the entire thickness of a substrate—such as a silicon wafer orchip. The through vias allow electric signals, as well as supply andreference voltages, to reach deep portions of the chip. In this way, itis possible to exploit the space offered by a chip in an enhanced way,by integrating circuit devices in multiple active layers formed atdifferent depths of the chip, with each active layer that is able toexchange electrical signals with the other ones by means of respectivesets of through vias. Furthermore, thanks to the through vias, electricsignals provided on a surface of the chip are able to cross the entirethickness of the chip, and reach the opposite surface thereof.

Presently, through vias are widely used for improving the so-calledMulti-Chip Modules (MCM).

An MCM is an electronic system implemented on multiple chips—each oneintegrating a respective electronic circuit—that are arranged in avertical stack. An MCM typically includes an interposer layer betweeneach pair of adjacent chips of the stack. Said interposer layers aregenerally crossed by conductive wires having the purpose of electricallyconnecting pads of the various chips in the stack. However, since thechips are stacked on each other, the routing of the conductive wirescrossing the interposer layers becomes very complicated, with acorresponding increase of the parasitic effects.

In order to reduce the negative impact resulting from complicatedrouting, modern MCMs are now implemented with chips having through vias.In this way, the exchange of electric signals between a pair of adjacentchips in the stack can be carried out by means of conductive paths (thethrough vias) that cross the higher chip in the pair, without the needof any conductive wire having to exit out of and move around the higherchip in order to reach the lower one.

Particularly, according to a first solution known in the art, the twoends of the through vias of the chips of the pair are provided withcorresponding pads made of conductive material, and formed on bothsurfaces of the chips. In this case, an electric signal generated by anelectronic circuit that is integrated on an upper surface of the higherchip can be fed to an electronic circuit integrated on an upper surfaceof the lower chip by simply wiring a pad formed on the lower surface ofthe higher chip with a corresponding pad on the upper surface of thelower chip.

Since the routing among the various chips of an MCM implemented in theway described above—i.e., by connecting the pads of the through vias—isdefinitely simpler compared to that required for an MCM including chipswithout any through via, the size of the interposer layers can bedrastically reduced.

According to a second solution known in the art, it is possible tofurther compact an MCM by completely removing the interposer layers.Particularly, instead of forming conductive pads on both the ends ofeach through via, a first end (e.g., the one corresponding to the uppersurface of the chip) is left “naked”, while the other end (e.g., the onecorresponding to the lower surface of the chip) is provided with asolder bump made of conductive material. In this case, the bumps on thelower surface of a chip can be directly soldered to the upper ends ofthe through vias of the chip underneath. More in detail, after havingcorrectly positioned the two chips in such a way to align the bumps on asurface of one chip to the ends of the through vias on the facingsurface of the other chip, heat is provided to melt the solder materialforming the bumps, so as to create a solid bond between the two chips.

However, none of the two solutions described above allows taking fulladvantage of the size miniaturization offered by the modern technologiesfor manufacturing integrated circuits. Indeed, even if moderntechnologies now allow obtaining through vias having very low diameters,the size of the pads and bumps that may be formed over the end of athrough via cannot be miniaturized to the same extent. For example, asit is described in the document “Si Through-Hole Interconnections FilledWith Au—Sn Solder by Molten Metal Suction Method” by Satoshi Yamamoto,Kazuhisa Itoi, Tatsuo Suemasu and Takashi Takizawa, Electron DeviceLaboratory, Fujikura Ltd., through vias may be generated by formingblind holes extending in the chip from a first surface thereof fillingsaid blind holes with conductive material according to the known MoltenMetal Suction Method (MMSM), and then removing portions of the chipstarting from the opposite surface of the chip until the conductivematerial is exposed. This solution allows obtaining through vias withdiameters lower than 30 μm. However, the typical diameter of a bumpobtainable with the current technologies is much larger, typically ofthe order of 100 μm, with potential scaling capability of 40/50 μm inthe following future. From these values it is clear that the number ofelectrical interconnections available on the surface of a chip for anMCM is strongly limited by the non-negligible size of the bumps. This isa serious problem, since a modern electronic system implemented on a MCMmay require a number of electrical interconnections equal to10,000-15,000. Using the solutions already known in the art,implementing an electronic system on an MCM with said high number ofelectrical interconnections requires the use of chips having widesurfaces, going against the trend of having electronic devicesminiaturized as much as possible.

Another important problem to be considered regards the routing ofelectronic systems for digital applications to be implemented by meansof MCMs. Generally, it is possible to functionally divide a genericelectronic system for digital applications in two main functional units,which have to communicate to each other: a processing unit, adapted toprocess data, and a memory unit, adapted to store the data to beprocessed by the processing unit. Thus, in an MCM for digitalapplications, the processing unit is implemented by means of a dedicatedchip integrating a microprocessor (baseband chip), while the memory unitis advantageously implemented by means of a set of chips each onededicated to integrate a respective memory circuit; for example, one ormore chips may integrate respective RAMs, further one or more chips mayintegrate respective ROMs or flash memories, and so on.

Naturally, an MCM made of a stack of memory chips together with thebaseband chip suffers from the abovementioned drawbacks as well due tothe non-negligible sizes of the bump obtainable with the actualtechnologies. Moreover, a MCM for digital applications generally suffersfrom additional routing drawbacks, mainly given by the great variety anddiversity of the chips that are stacked in a same MCM. Indeed, thenumber of electrical interconnections of the memory chips is in generalvery different from that of the baseband chip; moreover, the variousmemory chips are generally different from each other, and have generallyvery different sizes. Therefore, using the approaches known in the art,it is really difficult to implement an electronic system by means of anMCM having a compact size.

In view of the state of the art outlined in the foregoing, the Applicanthas faced the problem of how to improve the known solutions formanufacturing bumps for through vias.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention there is provided amethod for manufacturing solder bumps for through vias in a substratehaving a first surface and a second surface opposed to each other. Themethod includes the steps of forming a blind hole extending in thesubstrate from the first surface for each via and filling each blindhole with a conductive filler; a deepest part of each filler includes abump portion made of a solder material. The method further includes thestep of removing a part of the substrate extending from the secondsurface to have at least the bump portions protrude from the substrate.The non-protruding part of each filler defines the corresponding via andthe bump portion defines the corresponding bump.

According to another embodiment of the present invention there isprovided an electronic device comprising a substrate and a set of solderbumps being manufactured with this method.

According to another embodiment of the present invention there isprovided an electronic module including a plurality of these devices.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention itself, as well as further features and advantages thereofwill be best understood by reference to the following detaileddescription, given purely by way of a non-restrictive indication, to beread in conjunction with the accompanying drawings. In this respect, itis expressly intended that the figures are not necessarily drawn toscale and that, unless otherwise indicated, they are merely intended toconceptually illustrate the structures and procedures described herein.Particularly:

FIGS. 1-9 illustrate steps of a method for manufacturing solder bumpsfor through vias in a substrate according to an embodiment of thepresent invention;

FIG. 10 illustrates a sectional view of an electronic system implementedin the form of a MCM according to an embodiment of the presentinvention;

FIG. 11A illustrates a lower main surface of a baseband chip included inthe MCM of FIG. 10 in greater detail; and

FIG. 11B illustrates a lower main surface of a memory chip included inthe MCM of FIG. 10 in greater detail.

DETAILED DESCRIPTION

Referring to FIGS. 1 through 9, a method for manufacturing solder bumpsfor through vias in a substrate according to a first embodiment of thepresent invention is described. In particular, the drawings arecross-sectional views of the substrate that detail various steps of themethod for the generation of a through via and the solder bumpassociated thereto.

Considering in particular FIG. 1, the starting material is asemiconductor substrate 100, e.g., a silicon substrate, from now onreferred to with the simpler term of chip.

The chip 100, having a thickness T1, for example ranging from 200 μm to300 μm, comprises two main planar surfaces opposed to each other, namelyan upper surface S1 and a lower surface S2. The first step of the methodcomprises selectively forming a blind hole 105 extending in the chip 100from the upper surface S1. The blind hole 105 may be generated using oneamong the methods already known in the art, e.g., by means of a DeepReactive Ion Etching (DRIE) process or using a laser-based process. Theblind hole 105 is formed with a depth T2—lower than the thickness T1 ofthe chip 100—and a width (diameter) W1; the values of the depth T2 andof the width W1 depend on the desired size of the through via that hasto be manufactured. For example, the depth T2 of the blind hole 105 maybe of the order of 70-80 μm, while the width W1 thereof may be of theorder of 5-50 μm.

The following step is illustrated in FIG. 2, wherein an internalinsulating layer—identified in the figure with the reference 110—isformed on an internal surface of the blind hole 105. For example, anSiO2 film, an SiN film or the like is formed by use of thermal oxidationor Chemical Vapor Deposition (CVD). The thickness of the internalinsulating layer 110 may be, for example, of the order of 1 μm. Thepurpose of said internal insulating layer 110 is to electricallyinsulate the through via to be formed from the rest of the chip 100.

In the step illustrated in FIG. 3, the deepest portion of the blind hole105 is filled by a portion of solder material. As will be more clear inthe following portions of the present description, said portion ofsolder material—identified in the figure with the reference 115 and fromnow on referred to with the term of bump portion—will define the solderbump associated with the through via to be formed. For this reason, thethickness T3 of the bump portion 115 will also define the thickness ofthe resulting solder bump; for example, the thickness T3 may be of theorder of 5-10 μm. The solder material forming the bump portion 115 maybe a tin-based metallic alloy (for example, TiN or Silver Copper:SAC),or any other conductive material adapted to be used for conductivesoldering operations and having a relative low melting temperature. Thefilling operations of the blind hole 105 with the bump portion 115 maybe advantageously carried out using the MMSM.

The next step is illustrated in FIG. 4, wherein a film of barriermetal—identified in the figure with the reference 120—is deposed on thesurfaces of the blind hole 105 covered by the internal insulating layer110 and on the bump portion 115. As it is well known to those skilled inthe electronic, a barrier metal, 5 such as Co, Ru or TiN, is used toprevent diffusion of conductive materials, allowing at the same time tomaintain a good electronic contact.

In FIG. 5, after the deposition of the film of barrier metal 120, theportion of the blind hole 105 left empty is completely filled with aconductive material, forming a conductive portion—identified in thefigure with the reference 125. For example, the conductive material maybe Cu or any other conductive material having a melting temperaturehigher than that of the solder material; for example, the conductivematerial may be deposed into the blind hole 105 by means of anelectroplating process.

At this step, the blind hole 105 results to be completely filled by afiller, having a lower portion (of thickness T3) formed by the bumpportion 115 that will define the solder bump and an upper portion (ofthickness T2-T3) formed by the conductive portion 125 that will definethe through via. As previously mentioned, the film of barrier metalavoids having the conductive portion 125 diffuse into the surroundingmaterials, allowing at the same time maintaining a good electroniccontact with the bump portion 115.

In the FIGS. 6 and 7, the chip 100 is subjected to operations directedto reduce the thickness T1 of the chip 100, to have the bump portion 115(covered with the internal insulating layer 120) to protrude from thechip 100. Particularly, the lower surface S2 is firstly subjected toconventional (coarse) backgrinding operations, for reducing thethickness of the chip 100 to an intermediate thickness T4, for exampleranging from 90 μm to 100 μm (see FIG. 6). Then, through an etchingsolution, for example HF or HNO₃, the lower portion of the chip 100 isselectively etched in an accurate way, for example by means of aspin-etching process, in such a way to expose the bump portion 115coated with the internal insulating layer 110. After the etchingprocess, a new lower surface of the chip 100—identified in FIG. 7 withthe reference S3—is defined, with the chip 100 that reaches a finalthickness T5, for example ranging from 70 μm to 80 μm.

At this point the through via is completely formed, comprising inparticular the conductive portion 125—coated with the internalinsulating layer 110 and the film of barrier metal 120—that is embeddedin the chip 100.

The remaining steps of the method are instead directed to operations tobe performed on the protruding bump portion 115 to form the solder bumpassociated with the through via.

Particularly, in the step illustrated in FIG. 8, an external insulatinglayer—identified in the figure with the reference 130—is formed on thebottom of the chip 100 to cover the lower surface S3 and the internalinsulating layer 110 covering the protruding bump portion 115.

The last step is illustrated in FIG. 9, wherein the chip 100 issubjected to an anisotropic etching process directed to expose thesolder material of the protruding bump portion 115 to define the solderbump. Particularly, the external insulating layer 130 and the portionsof the internal insulating layer 110 covering the protruding bumpportion 115 are etched until exposing the lower surface S3 and theprotruding bump portion 115; residual portions of the externalinsulating layer 130 are left around the protruding bump portion 115 todefine an insulating spacer 135 having the purpose of maintaining thebump portion 115 insulated from the rest of the chip 100, i.e., itslower surface S3.

Thus, at the end of the step illustrated in FIG. 9, the chip 100 isprovided with a through via—defined by the conductive portion 125embedded in the chip—with a solder bump—defined by the exposed andprotruding bump portion 115—associated with an end of the through via.

In principle, the method according to an embodiment of the presentinvention comprising creating bumps during the process directed tomanufacture the through vias. Said bumps are generated together with thethrough vias by forming blind holes in the chip, partially filling saidholes with solder material, finishing to fill the holes with conductivematerial and then removing portions of the chip to expose the soldermaterial.

Thanks to this solution it is possible to manufacture solder bumpshaving the same size (in particular, the same diameter) of that of thethrough vias. In this way, it is possible to exploit at best thesurfaces of the chip, forming a high number of through vias in the samechip without occurring in the drawbacks described in the introduction ofthe present description.

Making reference to the exemplary values used in the description withreference to the FIGS. 1-9, with the proposed solution it is possible toproduce solder bumps having diameters of the order of 5 μm.

Moreover, the proposed method does not require the use of dedicated andexpensive processing tools and machineries, since the solder bumps aregenerated using the same instrumentations already available formanufacturing the through vias. Indeed, with the proposed solution it ispossible to produce solder bumps having the same diameter of the throughvias without having to introduce additional complex manufacturing steps.

Another advantage of the present solution comprises in the fact that thesolder bumps manufactured according to the proposed method resultautomatically aligned with the associated through vias. This is a greatbenefit, since with the solutions already known in the art, the solderbumps need to be formed on the ends of the through vias after thegeneration thereof, and thus they require to be carefully aligned withthe through vias.

In the following of the present description an electronic systemimplemented in the form of a MCM will be described according to anembodiment of the present invention.

Particularly, in FIG. 10 a sectional view of an electronic systemimplemented in the form of a MCM, globally identified as 1000, isillustrated; the MCM 1000 includes a plurality of electronic circuitseach one integrated in a respective chip 1100(i) (i=1 to n).

According to this embodiment of the invention, the MCM 1000 is suitablefor digital applications, and comprises two main functional unitsinteracting with each other, i.e., a processing unit 1150 and a memoryunit 1200. The processing unit 1150 includes a single chip 1100(1)(hereinafter referred to as “baseband chip”) that integrates a processor(not shown in the figure) adapted to process data. Moreover, thebaseband chip 1100(1) is also adapted to exchange signals with theoutside of the MCM 1000. The memory unit 1200 includes a plurality ofchips 1100(2)-1100(n) (hereinafter referred to as “memory chips”) eachone integrating a respective memory circuit (not shown in the figure)adapted to store the data to be processed by the processor unit.

The chips 1100(1)-1100(n) are vertically stacked on each other in such away to form a stack 1250, with the baseband chip 1100(1) at the bottomand the memory chip 1100(n) at the top of the stack 1250. Preferably,the stack 1250 is installed on a suitable chip carrier, for example amulti-layer substrate 1300 like those normally used for the packaging ofthe Ball Grid Array (BGA) devices, i.e., including several layers formedby different materials, like plastics or ceramics.

In order to improve the structural stability of the MCM 1000, the chips1100(i) are also enclosed in a protective molding 1320, e.g., made ofproper resins.

Each chip 1100(i) includes a respective lower main surface LS(i) facingtoward the substrate 1300, and an upper main surface US(i) opposed tothe lower main surface LS(i).

The baseband chip 1100(1) includes a set of external contacting pads EPon the lower surface LS(1) for exchanging electrical signals with theoutside of the MCM 1000—through the substrate 1300, as will be describedin the following—in such a way to allow the MCM 1000 to communicate withexternal peripherals. In particular, the external contacting pads EP areadapted to exchange, with the outside of the MCM 1000, dedicated signalsfor the microprocessor integrated in the baseband chip 1100(1),necessary for the operation thereof.

Each chip 1100(i) included in the MCM 1000 is provided with a respectiveset of through vias TV(i) allowing the passage of electrical signalsfrom its lower surface LS(i) to its upper surface US(i) and vice versa.Each through via TV(i) ends with a corresponding solder bump SB(i)formed on the lower surface LS(i) of the chip 1100(i) embedding thethrough via TV(i). As will be described in detail 30 in the following ofthe present description, the through vias TV(i) of the various chips1100(i) in the stack 1250 allow the baseband chip 1100(1) to exchangesignals with the memory chips 1100(2)-1100(n).

The through vias TV(i) and the corresponding solder bumps SB(i) are madeusing the method previously described with reference to FIGS. 1-9, witheach through via TV(i) and solder bump that may have, e.g., a diameterof about 5 μm.

The through vias TV(i) are arranged in such a way that each solder bumpSB(i) on the lower surface LS(i) of a chip 1100(i) is aligned with theend of a corresponding through via TV(i-1) on the upper surface US(i-1)of the preceding chip 1100(i-1) in the stack 1250. In this way, bydirectly soldering the solder bumps SB(i) of the chip 1100(i) to theends of corresponding through vias TV(i-1) on the upper surface US(i-1)of the chip 1100(i-1), the two adjacent chips 1100(i), 1100(i-1) areable to exchange electric signals.

Moreover, since the electrical signals may travel from the lower surfaceLS(i) of a chip 1100(i) to its upper surface US(i) and vice versa, anelectric signal output by a through via TV(1) of the baseband chip1100(1) is able to reach a corresponding through via TV(i) of a genericmemory chip 1100(i) of the stack 1250 following a (vertical) conductivepath that crosses the chips 1100(2)-1100(i-1) preceding said memory chip1100(i) in the stack 1250, and in particular by means of the respectivetrough vias TV(2)-TV(i-1). The same conductive path may also be used inthe opposite direction, i.e., it may be used by said generic memory chip1100(i) for providing electric signals to said through via TV(1) of thebaseband chip 1100(1).

Therefore, according to the proposed solution, the conductive paths thatallow the various chips 1100(i) in the stack 1250 to exchange signalsare made by series of aligned vias (interconnected to each other bymeans of respective solder bumps).

Naturally, in order to guarantee such alignment, both the baseband chip1100(1) and the memory chips 1100(2)-1100(n-1) need to have the throughvias TV(i) in the same positions.

In this way, it is not necessary to provide interposer layers betweeneach pair of adjacent chips 1100(i). With the proposed arrangement, thevarious chips 1100(i) of the stack 1250 are able to exchange signals toeach other without the need of complicated routing structures, thepresence of the solder bumps being sufficient.

In order to exchange signals with the outside of the MCM 1000, both theexternal contacting pads EP and the solder bumps SB(1) associated withthe through vias TV(i) of the baseband chip 1100(1) are connected withrespective interface pads SPU on an upper surface of the substrate 1300.Particularly, the external contacting pads EP are connected with theinterface pads SPU by means of dedicated electrical interconnectionsEC(1)—for example, balls of solder—, while the solder bumps SB(1)associated with the through vias TV(1) are directly soldered on theinterface pads SPU. Said interface pads SPU are then electricallyconnected with I/O substrate pads SPL on a lower surface of thesubstrate 1300, by means of corresponding electrical links, whosestructure depends on how the substrate 1300 is arranged (e.g., by meansof conductive tracks).

According to the proposed solution, it is possible to easily accommodate(in the MCM 1000) memory chips 1100(i) having really different sizes,since the sizes of said memory chips do not influence the positions ofthe through vias TV(i).

According to an embodiment of the present invention, each set of throughvias TV(i) is arranged on a central portion of the chip 1100(i). Forexample, the through vias TV(i) of each set can be arranged according toa squared array, as illustrated in the FIGS. 11A-11B. Particularly, atop plan view of the lower main surface LS(1) of the baseband chip1100(1) is illustrated in greater detail in FIG. 11A, while a top planview of view of the lower main surface LS(i) of a generic memory chip1100(i) is illustrated in greater detail in FIG. 11B.

Moreover, according to an embodiment of the present invention, theexternal contacting pads EP are arranged on a peripheral portion of thelower main surface LS(1) of the baseband chip, in such a way not tointerfere with the (vertical) conductive paths defined by the throughvias TV(i) of the stacked chips 1100(i).

The present invention has been described making reference to someexemplary embodiments. Naturally, in order to satisfy contingent andspecific requirements, a person skilled in the art may apply to thesolution described above many modifications and alterations. It shouldbe understood that various omissions, substitutions and changes in theform and details of the described embodiments, as well as otherembodiments are possible; moreover, it is expressly intended thatspecific elements and/or method steps described in connection with anydisclosed embodiment of the invention may be incorporated in any otherembodiment as a general matter of design choice.

For example, the proposed solution may be implemented with an equivalentmethod (using similar steps, removing non essential steps or addingoptional steps).

Even if in the present description reference has been made to asubstrate made of silicon, similar considerations apply if the proposedmethod is used for forming through vias and solder bumps in substratesmade of different materials.

Nothing prevents from exposing the bump portions from the substrate in adifferent way, e.g., with a single etching operation, and by a differentamount, e.g., together with a portion of the conductive material of eachconductive filler.

Similar considerations apply if the through vias and/or the solder bumpshave different shapes and sizes, and/or are made of different materials.

The concepts of the present invention are also applicable in case thestep of covering the internal surface of the blind hole with thedielectric layer before filling the blind hole is not performed.However, in this case the substrate has to be made of a non-conductivematerial, like ceramic, that does not require to be electricallyinsulated from the through via that embeds.

Similar considerations apply in case the insulating spacers around theprotruding bump portions are not formed.

Even if less advantageous, the concepts of the present invention can bealso applied in case the conductive material is deposed in the blindhole directly on the bump portion, without any barrier metal.

Even if in the present description reference has been made to a MMSMmethod, nothing prevents from filling the blind holes with the soldermaterial in a different way.

Similar considerations apply for the step of completing the filling withthe conductive material, which can be performed in a different way.

Naturally, even if in the present description reference has been made toa method for forming through vias and solder bumps in a substrateadapted to be used in an MCM, the concepts of the present invention arealso applicable to substrates adapted to be used individually, e.g.,directly soldered according to a flip chip interconnection method to aprinted card board.

Although in the present description reference has been made inparticular to electronic systems for digital applications, similarconsiderations apply if the chips stacked on the baseband chip areauxiliary chips that do not necessarily include memory circuits, and/orif the baseband chip includes a circuit different from a microprocessor.

The proposed MCM may also be implemented with the electronic devicesprovided with standard pads; in this case, the pads of adjacentelectronic devices in the stack may be electrically interconnected bymeans of wires or standard solder bumps.

Nothing prevents from overturning the stack, and stacking the memorychips under the baseband chip; in this case, the baseband chip will beaccessed from the outside by means of the external connecting pads onthe upper surface thereof.

Even if less advantageous, the concepts of the present application maybe applied in case the through vias are located in a position differentfrom the central portion of the chips; for example, the through vias maybe positioned within a same edge portion of each semiconductor chip.

Similar considerations apply for the position of the external connectingpads, which can be arranged in zones of the baseband chip that aredifferent from the peripheral portion thereof; in any case, the locationof said external connecting pads should not interfere with theconductive paths defined by the through vias of the stackedsemiconductor chips.

For example, an alternative way of implementing the proposed solutionprovides for arranging the through vias on the semiconductor chipsaccording to an array different from the squared one illustrated in thefigure.

Similar considerations apply if the number of through vias of eachmemory chip is different. However, in order to allow each through via ofeach memory chip in the stack to be reached by a through via of thebaseband chip, the number of through vias of each memory chip should benot higher than the number of through vias of the preceding memory chipin the stack.

The proposed MCM may be used in any complex system (such as a computer).

Having thus described at least one illustrative embodiment of theinvention, various alterations, modifications, and improvements willreadily occur to those skilled in the art. Such alterations,modifications, and improvements are intended to be within the spirit andscope of the invention. Accordingly, the foregoing description is by wayof example only and is not intended as limiting. The invention islimited only as defined in the following claims and the equivalentsthereto.

1. A method for manufacturing solder bumps for through vias in asubstrate having a first surface and a second surface opposed to eachother, the method including the steps of: forming a blind hole extendingin the substrate from the first surface for each via; filling each blindhole with a conductive filler, a deepest part of each filler including abump portion made of a solder material; removing a part of the substrateextending from the second surface to have at least the bump portionsprotrude from the substrate, the non-protruding part of each fillerdefining the corresponding via and the bump portion defining thecorresponding bump.
 2. The method of claim 1, wherein the substrate is asemiconductor substrate, for each blind hole the method furtherincluding: covering an internal surface of the blind hole with adielectric layer before filling the blind hole with the conductivefiller; and selectively removing the dielectric layer to expose at leastthe bump portion.
 3. The method of claim 1, wherein the step of fillingeach blind hole with the filler comprises: filling the blind holepartially with the solder material to form the bump portion, anddeposing a conductive material on the bump portion to complete thefilling, a melting temperature of the conductive material being higherthan the melting temperature of the solder material.
 4. The method ofclaim 3, wherein the step of filling each blind hole with the fillerfurther includes deposing a film of barrier metal between the steps offilling the blind hole partially with the solder material and deposingthe conductive material.
 5. The method of claim 1, wherein the step ofremoving a part of the substrate extending from the second surfacedefines a third surface of the substrate, and wherein the method furtherincludes the steps of: covering the third surface of the substrate andthe protruding bump portions with a further dielectric layer, andselectively removing the dielectric layer to leave an insulating spaceraround each protruding bump portion on the third surface.
 6. The methodof claim 3, wherein the step of filling the blind hole partially withthe solder material to form the bump portion is carried out with aMolten Metal Suction Method.
 7. An electronic device comprising asubstrate, a set of through vias crossing the substrate, and a set ofsolder bumps, each one connected to a corresponding via, the vias andthe solder bumps being manufactured according to the method of claim 1.8. An electronic module including a plurality of electronic devicesaccording to claim 7, wherein: the electronic devices are arranged in anordered stack extending along a stacking direction, the solder bump ofeach via of each electronic device being connected to a correspondingvia of a preceding electronic device in the ordered stack, the connectedvias being aligned along the stacking direction.
 9. The electronicmodule of claim 8, wherein the through vias of each electronic deviceare arranged in a central portion of the electronic device.
 10. Theelectronic module of claim 9, wherein the plurality of electronicdevices includes a main electronic device and a set of auxiliaryelectronic devices, the main electronic device including a set ofexternal pads for exchanging electrical signals with the outside of themodule, the external pads being arranged in a peripheral portion of themain electronic device.